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Buffered Oxide Etchant (BOE)
Buffered Oxide Etchant (BOE)
Buffered Oxide Etchant (BOE)

Buffered Oxide Etchant (BOE) is a precisely formulated solution designed to control etching rates and enhance etching uniformity, primarily used for removing silicon dioxide (SiO₂) layers—a critical step in semiconductor manufacturing.

Chemical Reaction:

SiO₂ + 4HF + 2NH₄F → (NH₄)₂SiF₆ + 2H₂O

 

Detailed introduction

Key Applications

  • Dielectric Layer Etching：BOE precisely removes SiO₂ dielectric layers while maintaining circuit integrity, essential for advanced node fabrication.
  • Surface Cleaning：Effectively eliminates surface contaminants, ensuring wafer purity during processing.

 

Advantage：

  • Customizable Formulations
  • Ultra-High Purity (ppt-grade)
  • Flexible Packaging：Tank Lorry、200L drum、20L pail、Gallon bottle
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